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Cooled by

We’re building 10× better chip-cooling to unlock the next 100× better compute

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Cooling is the ultimate bottleneck for silicon chips that drive AI and cloud computing.

The next 100× increase in compute performance will require 10× better cooling and current data center cooling solutions can´t keep up with the rising heat.

Liquid cooling is the new standard, and we set the standard for designing, building, testing and mass-producing leading-edge liquid cooling for high-power chips in data centers.

High-end chips
are heating up

Cooling
datacenter
globally

water consumed annualy

100B

liters

Cooling datacenter
globally consumes
more electricity than

New York
& London

combined

GPU temperature90.5ºc

GPU memory clock2,000Mhz

GPU core voltage1.025V

GPU core load98%

GPU memory clock2,000Mhz

GPU thermal limit100ºc

Heatflux400w/cm2

GPU power1893W

40c+inlet temperature

Introducing CorintisChip cooling redefined

Unlock the next leap in compute performance with Corintis: Targeted microfluidic cooling, tailored for performance and efficiency, to reliably run the most powerful chips at the lowest possible temperatures. Designed with micro-scale precision for large-scale production, to future-proof your data center & HPC applications.

Up to 10× better chip-cooling

Be one step ahead of the heat by using our streamlined platform to design, build, test, and mass-produce the world’s best microfluidic cold plates and co-packaged cooling solutions. Achieve higher TDP with less flow rate and pressure drop in a shorter cycle time. Just like nature, we harness evolution to tailor cooling to the chip, bringing the right amount of liquid to the right location and achieving maximum cooling performance.